11:43 〜 11:50
[C-4-06] Re liable Low-Temperature Bonding between Flexible Substrates Using Nanocomposite Pastes
〇YINCHI - LU1
(1.Department of Materials Science and Engineering, National Chung Hsing University, Taichung 402, Taiwan)
https://doi.org/10.7567/SSDM.2021.C-4-06
