4:36 PM - 4:43 PM

[D-2-05] Experimental Validation of Thermal Couple Impedance Model for Accurate Die Temperature Estimation in Power Modules

〇Yohei Nakamura^1,3, Naotaka Kuroda¹, Ken Nakahara¹, Michihiro Shintani², Takashi Sato³ (1.ROHM Co., Ltd., 2.Graduate School of Sci. and Tech., Nara Inst. of Sci. and Tech., 3.Graduate School of Informatics, Kyoto Univ.)

https://doi.org/10.7567/SSDM.2021.D-2-05