Heat diffusion of SiC wafer in planar and depth direction during atmospheric pressure thermal plasma jet performed ultra-rapid thermal annealing (URTA) has been visualized by an optical-interference contactless thermometry (OICT) imaging technique. A software program has been developed on the basis of image preprocessing and database to extract 3.5-dimensional (D) (x, y, z, and time) temperature distributions from observations in reflectance. The combination of OICT imaging and this software program achieves to obtain a 3.5-D temperature distribution in 3 seconds and demonstrated that it has potential real-time temperature measurement technique on URTA systems.