The Japan Society of Applied Physics

2023 International Conference on Solid State Devices and Materials

2023 International Conference on Solid State Devices and Materials

2023年9月5日 〜 2023年10月31日
Nagoya Congress Center

10:45 〜 11:00

[F-4-01] On-Wafer 3D E-beam Detector Cube by FinFET CMOS Technologies

Yi-Han Huang1, Kuan-Chung Chiu1, ○Yu-Jie Teng1, Burn Jeng Lin1, Jiaw-Ren Shih2, Faith Yuh2, Yue-Der Chih2, Jonathan Chang2, Chrong Jung Lin1, Ya-Chin King1 (1. Inst. of Electronics Engineering, National Tsing Hua Univ. (Taiwan), 2. Taiwan Semiconductor Manufac. Company (Taiwan))

https://doi.org/10.7567/SSDM.2023.F-4-01

A novel 3D E-beam Detector Cube (3D-EDC) realized by CMOS FinFET process is proposed for profiling e-beam distributions in X, Y and Z dimensions. With the 3D stacked sensing pads and coupled structure, electrons injected at different points of the cube array can be stored and readout by off-line measurement systems. The proposed e-beam cube array has successfully demonstrated the ability of obtaining the electron distributions after e-beam exposure in this work.