Superconducting Hollow TSV for Quantum Computing

Jaber Derakhshandeh

doi:https://doi.org/10.7567/SSDM.2023.G-1-05

3:15 PM - 3:30 PM

[G-1-05] Superconducting Hollow TSV for Quantum Computing

^○Jaber Derakhshandeh¹, Roy Li¹, Geraldine Jamieson¹, Gabriela dos Santos², Bogdan Govoreanu¹, Andy Miller1¹, Eric Beyne¹ (1. IMEC (Belgium), 2. Beneq (Finland))

https://doi.org/10.7567/SSDM.2023.G-1-05

In this paper a process flow for superconducting TSVs is proposed which can be used for quantum computing applications. SC hollow TSVs show good electrical results at RT and good Tc values for this application.

2023 International Conference on Solid State Devices and Materials

[G-1-05] Superconducting Hollow TSV for Quantum Computing