The Japan Society of Applied Physics

2023 International Conference on Solid State Devices and Materials

2023 International Conference on Solid State Devices and Materials

2023年9月5日 〜 2023年10月31日
Nagoya Congress Center

17:00 〜 17:15

[G-2-04] Wafer Reconstitution: embedded multi-die III-V and silicon co-integration platform

○Gauri Vibhakar Karve1, Yunlong Li2, Vasyl Motsnyi1, Wei Wei1, Jakob Visker1, Francois Chancerel1, Jan Ackaert1, Renaud Puybaret1, Barundeb Dutta1, Deniz Sabuncuoglu Tezcan1, Lan Peng1, Philippe Soussan1, Simone Severi1, Haris Osman1 (1. IMEC (Belgium), 2. Zhejiang University (China))

https://doi.org/10.7567/SSDM.2023.G-2-04

Wafer reconstitution (WARE) is an embedded multi-die integration platform that allows for integration of heterogenous materials on 200/300mm Si substrates. This paper describes an integration flow for InP die attach to 200mm Silicon. Electrical measurements on InGaAs diodes fabricated on WARE wafers confirm that the performance is similar to devices on native InP substrates.