The Japan Society of Applied Physics

2023 International Conference on Solid State Devices and Materials

2023 International Conference on Solid State Devices and Materials

Sep 5, 2023 - Oct 31, 2023
Nagoya Congress Center

9:30 AM - 9:45 AM

[G-5-02] High-Bendable 3D Corrugated Interconnections for Chiplet-Embedded Flexible Hybrid Electronics Using Wafer-Level Packaging

○Chang Liu1, Tadaaki Hoshi1, Jiayi Shen1, Atsushi Shinoda1, Zehua Du1, Hisashi Kino1,2, Tetsu Tanaka1,2, Takafumi Fukushima1,2 (1. Graduate School of Eng., Tohoku Univ. (Japan), 2. Graduate School of Biomedical Eng., Tohoku Univ. (Japan))

https://doi.org/10.7567/SSDM.2023.G-5-02

Flexible hybrid electronics (FHE) have been attracting interest in this decade. They greatly enhanced flexibility and make the devices thinner. But the fabrication of conventional FHE requires ultra-thin dies to attach to the flexible substrate, whose stability is still uncertain. Our group has proposed the structurally new FHE, which is highly reliable for utilizing rigid and tiny dies. This study focuses on enhancing the mechanical performance of bendable interconnections realized by designing and fabricating their 3D structures. The resulting 3D corrugated interconnections show that the resistance change after a bending test with a curvature radius of 5 mm was drastically lowered in comparison with 2D planar interconnections.