Heterogeneous design and integration has been referred to as the fourth stage in the evolution of Moore's Law, as it enables us to integrate sets of chiplets into high performance computing packages with simultaneous improvements in power, performance, and area-cost. The need for high bandwidth and power-efficient interconnects between chiplets is driving new process technologies and automation technologies that address the higher feature densities and higher sensitivity to defects. This presentation will discuss two such technologies, hybrid bonding and advanced substrates, from an equipment supplier’s perspective, presenting approaches to addressing the challenges to bringing these technologies to high volume production.