The Japan Society of Applied Physics

2023 International Conference on Solid State Devices and Materials

2023 International Conference on Solid State Devices and Materials

Sep 5, 2023 - Oct 31, 2023
Nagoya Congress Center

4:30 PM - 4:45 PM

[K-2-03] 2-kbits 40-nm Hybrid Anti-fuse and D-fuse OTP-PUF MACRO by Enhancedsecurity-processed scheme with 100-ns of Program-time & Robust-retention in 200°C

○Po Hsiung Huang1, Y.H. Lin1, K.H. Chang1, T.H. Shen1, R.Y. Lyu1, K.Y. Lee1, M.L. Miu1, E Ray Hsieh1 (1. National Central University (Taiwan))

https://doi.org/10.7567/SSDM.2023.K-2-03

We present a 40nm 2T OTP-PUFs, which generates entropy by hybrid anti-fuse and dielectric fuse (dfuse) breakdown mechanisms. Results show that data retention at 200℃ is more than 1-month with a wide memory window (7000x). As far as cryptography is concerned, the PUF exhibits a near-ideal normal distribution of InterHamming distance (Inter-HD) at 49.77% and Intra-HD at 0%, and around 50% of Hamming weight through an enhanced security-processed scheme. Finally, our solution passed all NIST randomness tests in both 25℃ and 125℃ and proved itself in highly-strengthened security.