The Japan Society of Applied Physics

2023 International Conference on Solid State Devices and Materials

2023 International Conference on Solid State Devices and Materials

Sep 5, 2023 - Oct 31, 2023
Nagoya Congress Center

4:45 PM - 5:00 PM

[K-2-04] Investigation of Spin-on Films as Mold Stack and Controlling Wafer Warpage for 3D Memory Integration

○Soodoo Chae1, Hojin Kim1, Nayoung Bae1, Stephen Mancini2, Lior Huli1, Steven Gueci1, Dave Hetzer1, Sitaram Arkalgud1 (1. TEL Technology Center, America, LLC (United States of America), 2. College of Nanoscale Science and Engineering (United States of America))

https://doi.org/10.7567/SSDM.2023.K-2-04

Spin-on materials for 3D memory stacks were investigated. Stacking up to 7µm of Spin-on Glass (SOG) and Spin-on Carbon (SOC) resulted in below 250µm of wafer warpage, whereas using only 2µm of SiO2/Si3N4 led to 250µm of warpage. Through TEM inspection, we confirmed that the thickness and interface between the SOG and SOC layers were not affected during stacking. To control wafer warpage, we propose an alternative method using the scribe line as the warpage control line (WCL). Warpage simulations support the reduction of warpage with possible dimensions of the WCL, up to 200µm in depth and 100µm in width.