09:15 〜 09:30
[N-5-02] Role of P(O 2) in Annealing of the SiO 2/SiC Stack Formed by Si Deposition plus Oxidation
Annealing in N2 at the temperature low than 1250 oC on the SiC MOS formed by oxidizing Si layers deposited on SiC has been demonstrated to be effective in reducing the Dit and Nbt of the samples. We have confirmed that the oxygen partial pressure is the main factor leading to the above improvement through the N2/He annealing at 1200 oC and XPS measurement
