13:30 〜 13:32
[SO-PS-03-01] Development of Low-thermal-budget and Low-electrical-loss Heterogeneous Integration Platform by Glass Substrate and Area-Selective Passivation Technology
This paper presents the first demonstration of a novel heterogeneous integration platform that utilizes a glass substrate and area-selective passivation bonding. The validation process is with three test structures: (1) investigation of bonding quality, (2) electrical characteristic and reliability measurements of TGV, and (3) electrical measurements of three-layer circuit. The electrical characteristics and bonding interface of the platform have been well analyzed. Moreover, the platform exhibits negligible deterioration after HAST for 264 hours or 2000 loops of TCT, following the standards of JESD22-A118 and JESD22-A104B, respectively. The results indicate the potential of the platform for future applications.