The Japan Society of Applied Physics

2023 International Conference on Solid State Devices and Materials

2023 International Conference on Solid State Devices and Materials

2023年9月5日 〜 2023年10月31日
Nagoya Congress Center

13:36 〜 13:38

[SO-PS-03-04] Characteristic Verification of Flexible Printed Circuit Applied to System Circuit and Package with High Frequency and High Speed

○Meng-Hua TU1, CHIA-LIN HSIEH1, Sung-Mao Wu1, Shang-Chih Chou2 (1. National University of Kaohsiung (Taiwan), 2. Taiwan Textile Research Institute (Taiwan))

FPC (Flexible Printed Circuit) play an important role in system circuit and package with high frequency and speed. We discuss the characteristic of FPC mate-rial that variation with frequency. Designing the test circuits and simulating the SI/PI with electromagnetic simula-tion software. Then, Using new double-sided meas-urement environment with high frequency to measure the circuits. In the end, Comparing simulation with measurement. We are more sure about the material properties.