The Japan Society of Applied Physics

2023 International Conference on Solid State Devices and Materials

2023 International Conference on Solid State Devices and Materials

2023年9月5日 〜 2023年10月31日
Nagoya Congress Center

13:30 〜 13:32

[SO-PS-05-01] Photonic Inter-Layer Vias for Three-Dimensional Optical Signal Transmission and Effect of Increased Surface Recombination Velocity

○Yu-Chien Wei1, Ming-Hua Mao1,2,3 (1. Graduate Inst. of Electronics Eng., National Taiwan Univ. (Taiwan), 2. Department of Electrical Eng., National Taiwan Univ. (Taiwan), 3. Graduate Inst. of Photonics and Optoelectronics, National Taiwan Univ. (Taiwan))

We demonstrated three-dimensional (3D) all-optical digital signal transmission by the monolithically integrated photonic inter-layer vias (P-ILVs) with the effect of increased surface recombination velocity through ion-bombardment. The resonant wavelength of the device was modulated with the recovery time constant of 175 ps, which is almost 6 times shorter than that of the device without an ion-bombardment effect in our previous work. 4.2 or 6.8 Gb/s digital signal transmission can be potentially realized in this device. Therefore, this kind of device is a promising candidate for future high speed all-optical signal processing in monolithic 3D photonic integrated circuits (3D-PICs).