The 72nd Divisional Meeting of Division of Colloid and Surface Chemistry

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Regular Session (Poster)

5. Technology of Fine Particles and Colloidal Dispersions

[P089-115] 5. Technology of Fine Particles and Colloidal Dispersions

Fri. Sep 17, 2021 2:00 PM - 4:00 PM Technology and application of fine particles and colloidal dispersions (Poster)

[P094] Copper/Nickel mixed ink with low-temperature sintering, high conductivity, and oxidation resistance

*Rika Ogami1, Daisuke Tomotoshi2, Hideya Kawasaki3 (1. Graduate School of Science and Engineering, Kansai University (Japan), 2. Graduate School of Science and Engineering, Kansai University (Japan), 3. Faculty of Chemistry, Materials and Bioengineering (Japan))

Keywords:electronics, copper, Oxidation Resistance

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