*Rajan Rengarajan¹, A. Gupta¹, X. Xu¹, K. Yang¹, I. Zwieback¹, G. Ruland¹ (1. II-VI Advanced Materials(United States of America))

*SRaghavan Parthasarathy¹, Roman Drachev¹, Bob Berliner¹, Bala Bathey¹, Henry Chou¹ (1. GT Advanced Technologies Tech(United States of America))

*Kazuma Eto¹, Hiromasa Suo^1,2, Tomohisa Kato¹, Hajime Okumura¹ (1. National Institute of Advanced Industrial Science and Technology (AIST)(Japan), 2. Showa Denko K. K.(Japan))

*Peter J Wellmann¹, Philipp Schuh¹, M. Schöler¹, J. Steiner¹, M. Zielinski², M. Mauceri³, G. Litrico⁴, F. La Via⁴ (1. Univ. of Erlangen (FAU)(Germany), 2. NOVASIC(France), 3. LPE S.P.A.(Italy), 4. CNR-IMM(Italy))

*Rafael Dalmau¹, Jeffrey Britt¹, Raoul Schlesser¹ (1. HexaTech, Inc.(United States of America))

*Tuerxun Ailihumaer¹, Balaji Raghothamachar¹, Michael Dudley¹, Gilyong Chung², Ian Manning², Edward Sanchez² (1. Stony Brook Univ.(United States of America), 2. DuPont Inc.(United States of America))