Improving Heat Conduction of Insulated Metal Substrate with Thermal Pyrolytic Graphite Core for SiC Power Module Packaging

Wei Fan

Presentation information

Oral Presentation

Packaging and Applications

[Tu-1A] Packaging

Tue. Oct 1, 2019 8:45 AM - 10:15 AM Room A (Kyoto International Conference Center)

9:15 AM - 9:30 AM

[Tu-1A-02] Improving Heat Conduction of Insulated Metal Substrate with Thermal Pyrolytic Graphite Core for SiC Power Module Packaging

*Wei Fan¹, Garry Wexler², Emre Gurpinar³, Burak Ozpineci³ (1. Momentive Performance Materials Inc.(United States of America), 2. Henkel Corp.(United States of America), 3. Oak Ridge National Laboratory(United States of America))

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