ISLC2022

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Oral presentation

[WC] Silicon Integration 2

Wed. Oct 19, 2022 1:45 PM - 3:10 PM International Conference Hall (3F)

Session Chairs: Di Liang(Alibaba Group US), Nobuhiko Nishiyama(Tokyo Institute of Technology)

2:40 PM - 2:55 PM

[WC-04] GaAs Micro-disk Lasers on Membranes Grown by Lateral MOCVD on SOI Platform

*Qi LIN1, Jie HUANG1, Liying LIN1, Ying XUE1, Zengshan XING 2, Kam Sing WONG2, Kei May LAU1 (1. Department of Electronic and Computer Eng., Hong Kong Univ. of Sci. and Tech. (Hong Kong), 2. Department of Physics and William Mong Inst. of Nano Sci. and Tech., Hong Kong Univ. of Sci. and Tech. (Hong Kong))

Presentation style: On-site (in-person)

Keywords:lateral MOCVD, micro-disk lasers, GaAs-based