The 68th JSAP Spring Meeting 2021

Presentation information

Oral presentation

22 Joint Session M "Phonon Engineering" » 22.1 Joint Session M "Phonon Engineering"

[16a-Z32-1~10] 22.1 Joint Session M "Phonon Engineering"

Tue. Mar 16, 2021 9:30 AM - 12:15 PM Z32 (Z32)

Masahiro Nomura(Univ. of Tokyo), Toshio Baba(JST)

11:00 AM - 11:15 AM

[16a-Z32-6] Correlation between thermal conductivity and persistent homology in amorphous Si

Emi Minamitani1, Takuma Shiga2, Ippei Obayashi3, Makoto Kashiwagi4 (1.IMS, 2.UTokyo, 3.RIKEN, 4.AGU)

Keywords:Amorphous Si, thermal conductivity, persistent homology

The decrease of lattice thermal conductivity in amorphous materials is originated from the scattering of phonons by structural disorders. However, it has been difficult to discuss the relationship between structural properties and thermal conductivity. In this study, we applied the persistent homology group, which is one of the techniques to extract topology in various numerical data, to investigate whether there is a correlation between topological information and thermal conductivity in amorphous Si.