[16p-Z10-1~17] 3.15 Silicon photonics and integrated photonics

▲ [16p-Z10-15] Local thickness tuning or adjustment of SOI layer by u-transfer printing

〇(D)TzuHsiang Yen¹, Rai Kou¹, Makoto Okano¹, Koji Yamada¹ (1.National Inst. of AIST)

Keywords:device design, novel application, proposal, waveguides, passive devices, fiber couplers

Micro-transfer-printing technology has highly gained interest due to its parallel transfer of multiple devices. This technique utilizes PMDS to pick up the device individually or massively from the substrate and then print on a silicon photonics wafer with high alignment accuracy. To obtain an efficient coupling scheme, a thicker silicon waveguide (500 nm) would provides tight mode confinement and efficient mode filed transfer. In this work, we propose an approach to construct an efficiently coupling scheme by transferring an adiabatic silicon taper onto another silicon waveguide which allows us to control the thickness of any SOI platforms.