The 68th JSAP Spring Meeting 2021

Presentation information

Oral presentation

13 Semiconductors » 13.5 Semiconductor devices/ Interconnect/ Integration technologies

[17a-Z26-1~9] 13.5 Semiconductor devices/ Interconnect/ Integration technologies

Wed. Mar 17, 2021 9:00 AM - 11:15 AM Z26 (Z26)

Takao Marukame(Toshiba)

11:00 AM - 11:15 AM

[17a-Z26-9] Evaluation of NH2 conversion and barrier property in eletroless plating treatment of ultra-thin electroless NiB film

Takeyasu Saito1, Masashi Rindo1, Naoki Okamoto1, Akira Kitajima2 (1.Osaka Pref. Univ., 2.Nanotechnology Facilities, Osaka Univ.)

Keywords:NiB