The 68th JSAP Spring Meeting 2021

Presentation information

Oral presentation

15 Crystal Engineering » 15.6 Group IV Compound Semiconductors (SiC)

[18p-Z05-1~16] 15.6 Group IV Compound Semiconductors (SiC)

Thu. Mar 18, 2021 1:30 PM - 6:00 PM Z05 (Z05)

Takuji Hosoi(Osaka Univ.), Wakana Takeuchi(Aichi Inst. of Tech.), Hirohisa Hirai(AIST)

2:00 PM - 2:15 PM

[18p-Z05-3] Visualization of transient variation of internal temperature distribution during SiC-MOSFET operating using Optical-Interference Contactless Thermometer (OICT)

Keiya Fujimoto1, Koyanagi Tatsuki1, Takuma Sato1, Hiroaki Hanafusa1, Seiichiro Higashi1 (1.Graduate School of Advanced Science and Engineering,Hiroshima Univ.)

Keywords:OICT, SiC

Thermal design is indispensable for device fabrication, and although heat conduction is analyzed by various models, it is not possible to directly measure the exothermic process inside the device. In this study, we attempted to visualize the internal heat diffusion process during the operation of SiC-MOSFET by applying the Optical-Interference Contactless Thermometer (OICT) we developed.