The 68th JSAP Spring Meeting 2021

Presentation information

Oral presentation

13 Semiconductors » 13.7 Compound and power electron devices and process technology

[19p-Z25-1~14] 13.7 Compound and power electron devices and process technology

Fri. Mar 19, 2021 1:00 PM - 4:45 PM Z25 (Z25)

Masashi Kato(Nagoya Inst. of Tech.)

4:00 PM - 4:15 PM

[19p-Z25-12] Residual stress characterization of GaN/Diamond bonding interface by Raman spectroscopy

Ayaka Kobayashi1, Yasuo Shimizu2, Yutaka Ohno2, Seong-Woo Kim3, Koji Koyama3, Makoto Kasu4, Naoteru Shigekawa1, Jianbo Liang1 (1.OsakaCity Univ., 2.IMR Tohoku Univ., 3.AdamantNamikiPrecisionJewel Co.,Ltd., 4.Saga Univ.)

Keywords:GaN