STF Sendai 2022 opens to optional virtual participation!
In response to considering the possible COVID-19 travel restrictions, the Organizing Committee has decided to allow optional online participation as well as an in-person meeting. Participants will be asked to select their participation format, either in-person or online, during registration. We hope this in-person/online hybrid format would allow our friends and colleagues to participate with minimal interference from the effect of the pandemic.
We have asked all the presenters (including plenary lectures and technical sessions) to submit pre-recorded presentation videos. The conference registrants can view each video file after the conference.
22.07.11 On-site COVID-19 Guidlines is annoucned.
22.07.06 Final program of technical sessions is now online.
22.06.02 Provisional schedule and program of technical sessions are now online.
22.05.24 Abstracts of plenary lectures
22,04.27 Early bird registration deadline extended (May 31, 2022)
22.04.22 Hotel information
22.02.01 Registration is now open.
22.01.26 Re-Extension of abstract submission deadline (February 28, 2022)
21.12.23 Extension of abstract submission deadline (January 28, 2022)
21.12.22 Plenary speakers
21.11.24 STF 2022 opens to optional virtual participation!
21.09.15 Abstract submission is open.
21.09.15 Conference website is open.
International Conference on Slips, Trips, and Falls (STF) was first held in Hopkinton, USA (2007), following with successful conferences in Nottingham, UK (2008), Beijing, China (2009), Morgantown, USA (2010), Buxton, UK (2011), Recife, Brazil (2012), Tokyo, Japan (2013), Melbourne, Australia (2015), London, UK (2016), Toronto, Canada (2017), Florence, Italy (2018) and Madrid, Spain (2020). In 2022, the international STF conference will be held in Tohoku University, Sendai, Japan.
This conference will provide a technical forum to discuss various aspects of fall protection in the community and workplace. Researchers, policy makers, technical experts and others around the world will present their latest work, products, and exchange research ideas.