The Japan Society of Applied Physics

11:45 〜 12:00

[C-4-03] Bumpless Build Cube (BBCube) using Wafer-on-Wafer (WOW) Technologywith 3D-manner Redundancy Scheme

〇Shinji Sugatani1, Norio Chujo1, Koji Sakui1, Hiroyuki Ryoson1, Tomoji Nakamura1, Takayuki Ohba1 (1. Tokyo Institute of Technology(Japan))

https://doi.org/10.7567/SSDM.2020.C-4-03