10:50 AM - 11:10 AM
[OS9-2-01] Thermal Boundary Resistance of Ruthenium Interconnects in Next Generation VLSI
Keywords:Thermal Boundary Resistance, Ruthenium Interconnects, Thermal Management, Interfacial Bonding
Oral Presentation
OS9
Fri. Sep 30, 2022 10:50 AM - 11:50 AM Room 4 (Zoom room 4)
Chair:Satoru Momoki(Nagasaki University, Japan),
Tomoyuki Hatakeyama(Toyama Prefectural University, Japan)
10:50 AM - 11:10 AM
Keywords:Thermal Boundary Resistance, Ruthenium Interconnects, Thermal Management, Interfacial Bonding