[Th-2A] Device Processing

[Th-2A-03] The Waffle Substrate: A Novel Approach to Reducing Substrate Resistance in SiC Power Devices

Noah Opondo¹, *James A Cooper², Hangjie Liao¹, Weinong W. Chen¹, Dallas T. Morrisette¹ (1. Purdue Univ.(United States of America), 2. Sonrisa Research, Inc., and Purdue Univ.(United States of America))