[G] Solid process/ Solid and welding process

[383] Delamination Analysis at the Dielectric Film / Redistribution Layer Interface in Semiconductor Package Structure using Cohesive Zone Model

*Yusei HAMADA¹, Yoshiharu KARIYA² (1. Graduate School of Shibaura Institute of Technology, 2. Department of Materials Science and Engineering, Shibaura Institute of Technology)

Keywords:Semiconductor Package、Dielectric film、Finite Element Method、Cohesive Zone Model、Critical energy release rate

仮想き裂を必要としない結合力モデルを用い，半導体パッケージ再配線層中の絶縁膜 / 再配線界面の剥離発生箇所を推定した．