[17a-PG3-1~15] 15.6 IV-group-based compounds

[17a-PG3-15] High-speed Dicing of SiC Wafers by Ultra Short Pulse Laser

^○Akira Nakajima¹, Yosuke Tateishi³, Hiroshi Murakami¹, Hidetomo Takahashi³, Michiharu Ota³, Ryouji Kosugi², Takeshi Mitani², Shin-ichi Nishizawa¹, Hiromichi Ohashi¹ (ETRI AIST¹, ADPERC AIST², Aisin Seiki³)

Keywords:Laser dicing,SiC,パワーデバイス