The 61st JSAP Spring Meeting, 2014

Presentation information

Oral presentation

13. Semiconductors A (Silicon) » 13.3 Si Process・Interconnect・MEMS・Integration

[18a-E14-1~10] 13.3 Si Process・Interconnect・MEMS・Integration

Tue. Mar 18, 2014 9:00 AM - 11:45 AM E14 (E302)

9:45 AM - 10:00 AM

[18a-E14-4] Silicon micromechanical resonator with high quality factor fabricated by damage-free neutral beam etching process

Halubai Sekhar1, Tomohiro Kubota1, Van Toan Nguyen2, Takahito Ono2, Seiji Samukawa1,3 (IFS, Tohoku Univ.1, Graduate School of Engineering, Tohoku Univ.2, WPI-AIMR, Tohoku Univ.3)

Keywords:中性粒子ビームエッチング,シリコンレゾネータ,エッチングダメージ