[18p-D9-1~6] Flexible Electronics

▲ [18p-D9-2] Low Coefficient of Linear Thermal Expansion Polyimide Film for Device Substrate.(30min.)

^○Tetsuo Okuyama¹,Kousuke Sasai¹,Katsuki Nakase¹,Kazuyuki Oya¹,Muneatsu Nakamura¹ (Toyobo Co., Ltd Research Center¹)

キーワード：ポリイミド　,フレキシブル,CTE