[20a-E18-1~7] 17.3 Exploration of new functions and evaluation of basic properties

[20a-E18-5] Numerical Simulations on High Heat Dissipation Properties of Nano-Carbon Thermal Management Devices for LSI 3-D Packaging

^○（M2）Teppei Kawanabe¹, Mizuhisa Nihei², Yuji Awano¹ (Keio Univ.¹, GNC-AIST²)

Keywords:ナノカーボン