The 63rd JSAP Spring Meeting, 2016

Presentation information

Oral presentation

6 Thin Films and Surfaces » 6.3 Oxide electronics

[21p-H111-1~22] 6.3 Oxide electronics

Mon. Mar 21, 2016 1:00 PM - 6:45 PM H111 (H)

Hisashi Shima(AIST), Yasuhisa Naitoh(AIST)

6:00 PM - 6:15 PM

[21p-H111-20] Reliability evaluation of anion diffusion type ReRAM based on charge state

Kouhei Kimura1, Koutoku Ohmi1,2, Satoru Kishida1,2,3, Kentaro Kinoshita1,2,3 (1.Tottori Univ., 2.TEDREC, 3.TiFREC)

Keywords:resistive random access memory,Ultraviolet,Soft error

It is getting more and more serious to generate soft-errors by cosmic radiation, with increasing the density of memory devices. Therefore, the irradiation resistance of resistance random access memory (ReRAM) to cosmic radiation has to be elucidated for practical use. In this paper, we investigated the data retention characteristics against ultraviolet irradiation to ReRAM with Pt/NiO/ITO structure. Soft-errors were confirmed to be caused by ultraviolet irradiation in both low and high resistance states. The analysis of irradiation frequency dependence of data retention characteristics suggested that electronic excitation by the irradiation caused the errors. Based on a statistically estimated soft-error rate, the errors were suggested to be caused by aggregation and dispersion of oxygen vacancies due to the generation of electron-hole pairs and valence change by the ultraviolet irradiation.