Weicheng Fang

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発表者・著者、共著者

2019年9月20日(金) 10:00 〜 11:45 E215 (E215)

一般セッション(口頭講演)
| 4 JSAP-OSA Joint Symposia 2019
| 4.2 Photonics Devices, Photonic Integrated Circuit and Silicon Photonics

[20a-E215-1~6] 4.2 Photonics Devices, Photonic Integrated Circuit and Silicon Photonics

10:30 〜 10:45

▲ [20a-E215-2] Investigation of bonding strength between (InP, Si)/SiO2 and Si by Surface Activated Bonding based on Fast Atom Beam assisted by Si nano-film

〇(M2)Weicheng Fang¹、Yuning Wang¹、Tomohiro Amemiya^1,2、Nobuhiko Nishiyama^1,2 (1.Titech、2.FIRST)