[9a-PB2-1~9] 3.15 Silicon photonics

[9a-PB2-8] bonding of InP-based laser diode on Si platform using polymer intermediate layer

〇Yuki Kinoshita¹, Ryousuke Morita¹, Kana Shimizu¹, Yuichi Matsusima², Hirosi Ishikawa¹, Katsuyuki Utaka¹ (1.waseda univ., 2.GCS,waseda univ.)

Keywords:bonding