[9p-S223-1~12] 7.3 Micro/Nano patterning and fabrication

[9p-S223-12] Mask Fabrication for Quartz Glass Deep Etching by use of Electroless Ni Plating

Ryuichirou Oohoto¹, 〇Hiroaki Kawata¹, Masaaki Yasuda¹, Yoshihiko Hirai¹ (1.Osaka Pre Univ.)

Keywords:etching mask, electrodeless Ni plating, deep etching

Since the mask etching selectivity for a quartz plasma etching is often small, it is difficult to obtain quartz deep etching. Since a nickel is hardly etched by conventional etching conditions, Ni mask is suitable for quartz deep etching. In this report, Ni etching mask is fabricated by electroless Ni plating where no vacuum process is required. Two processes where Ni mask pattern is same as the resist pattern (posi process) and Ni mask pattern is reverse to the resist pattern (nega process) are developed.