Oral Presentation
03: Interconnect / 3D Integrations / MEMS
Thu. Sep 29, 2022 9:00 AM - 10:45 AM 105 (1F)
Session Chair: Akinobu Yamaguchi (Univ. of Hyogo), Takeo Minari (NIMS)
Cancelled
9:00 AM - 9:30 AM
〇Tadashi Inoue1 (1. MMI Semiconductor Co., Ltd. (Japan))
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9:30 AM - 9:45 AM
〇Tadaaki Hoshi1, Yuki Susumago1, Liu Chang1, Atsushi Shinoda2, Hisashi Kino3, Tetsu Tanaka1,3, Takafumi Fukushima1,3 (1. Dept. of Mechanical Systems Engineering, Graduate School of Engineering, Univ. of Tohoku (Japan), 2. Dept. of Mechanical and Aerospace Engineering, School of Engineering, Univ of Tohoku (Japan), 3. Dept. of Biomedical Engineering, Graduate School of Biomedical Engineering, Univ. of Tohoku (Japan))
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9:45 AM - 10:00 AM
〇Wei-Rong Yang1, Yu-Shun Su1, Jenn-Ming Song1, Watson Kuo1, Shien-Der Tzeng2, Kiyokazu Yasuda3 (1. National Chung Hsing University (Taiwan), 2. National Dong Hwa University (Taiwan), 3. Osaka University (Japan))
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10:00 AM - 10:15 AM
〇Akinobu Yamaguchi1, Taku Tanaka1, Shunya Saegusa1, Masayuki Naya2,1, Takao Fukuoka3, Sho Amano1, Yuichi Utsumi1 (1. Univ. of Hyogo (Japan), 2. Keio Univ. (Japan), 3. Kyoto Univ. (Japan))
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10:15 AM - 10:30 AM
〇Shun Nakajima1, Yoko Wasai2, Kenji Kawahara3, Nataliya Nabatova-Gabain2, Hiroki Ago3, Hiroyuki Akinaga4, Kazuyoshi Ueno1 (1. Shibaura Inst. Tech. (Japan), 2. Horiba Techno Service Co. Ltd. (Japan), 3. Kyushu Univ. (Japan), 4. Nat. Inst. Adv. Indus. Sci. Tech. (Japan))
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10:30 AM - 10:45 AM
〇Takeyasu Saito1, Kohei Yamada1, Ryosuke Komoda1, Naoki Okamoto1 (1. Osaka Metropolitan University (Japan))
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