[B2-2] A Novel Planar Multilevel Interconnection Technology Utilizing Polyimide

SEIKI HARADA、KIKUJI SATO、ATSUSHI SAIKI、TAKESHI KIMURA TOSHIO OKUBO、KIICHIRO MUKAI (1.Central Research Laboratory, Hitachi Ltd.)

https://doi.org/10.7567/SSDM.1974.B2-2