[PC-1-14] Thermal Stability of an Interconnect of TiN/Cu/TiN Multilayered Structure

Y. Igarashi, T. Yamanobe, T. Yamaji, S. Nishikawa, T. Ito (1.Semiconductor Technology Laboratory, OKI Electric Industry Co., Ltd.)

https://doi.org/10.7567/SSDM.1993.PC-1-14