[A-9-3] Fine Pitch CSP Technology Using Au Ball Bumps as External Terminals

Shinsuke Nakajyo, Masanori Onodera, Masamitsu Ikumo, Toshimi Kawahara (1.Advanced Packaging Tech. R&D Dept. LSI Packaging Div., Fujitsu Ltd.)

https://doi.org/10.7567/SSDM.2000.A-9-3