[A-1-5] CMP Using Fixed Abrasive Tool (FX-CMP) for Dielectric Planarization

S. Katagiri、K. Yasui、Y. Kawamura、U. Yamaguchi、M. Nagasawa、F. Kanai、R. Kawai、M. Tokuda、S. Moriyama、N. Yamada (1.Central Research Laboratory, Hitachi, Ltd.、2.Semiconductor & Integrated circuits, Hitachi, Ltd.、3.Manufacturing Engineering & Environmental Policy Department, Hitachi, Ltd.、4.Instruments, Hitachi, Ltd.、5.Institute of Technologists、6.Nihon Tokushu Kento co., Ltd.)

https://doi.org/10.7567/SSDM.2001.A-1-5