[D-8-4] Hard Mask through UV Light-induced Damage to Low-k Film During Plasma Process for Dual Damascene

N. Matsunaga^1,2、H. Okumura¹、B. Jinnai¹、S. Samukawa¹ (1.Tohoku Univ.(Japan)、2.Toshiba Corp.(Japan))

https://doi.org/10.7567/SSDM.2009.D-8-4