[G-7-2] Local Bending Stress Reduction with Room-Temperature Curing Adhesive for Decrease in Keep-out-Zone (KOZ) of 3D IC

H. Kino¹、T. Fukushima¹、K.W. Lee¹、M. Koyanagi¹、T. Tanaka¹ (1.Tohoku Univ. (Japan))

https://doi.org/10.7567/SSDM.2013.G-7-2