[A-1-3] Interface Engineering in Homogeneous Barrier Modulation RRAM for 3D Vertical Memory Applications
W.L. Lai1、C.T. Chou1、C.W. Hsu1、J.C. Liu1、B. Hudec1、C.H. Ho2、W.Y. Jang2、C.H. Lin2、T.H. Hou1
(1.NCTU、2.Winbond Electronics Corp. (Taiwan))
https://doi.org/10.7567/SSDM.2014.A-1-3
