09:30 〜 09:45

[J-5-02] Texture Control for Cu Hybrid Bonding Pads using a PVD Cu Process

^○J. De Messemaeker¹, N. Jourdan¹, P. Nolmans¹, S.-W. Kim¹, G. Beyer¹ (1.imec (Belgium))

https://doi.org/10.7567/SSDM.2019.J-5-02