The Japan Society of Applied Physics

16:20 〜 16:40

[E-4-3] Reliability Results of 4 million Micro Bump Interconnections of 3D Stacked 16 M Pixel Image Sensor

Y. Takemoto1, N. Takazawa1, M. Tsukimura1, H. Saito1, T. Kondo1, H. Kato1, J. Aoki1, K. Kobayashi1, S. Suzuki1, Y. Gomi1, S. Matsuda1, Y. Tadaki1 (1.Olympus Corp.(Japan))

https://doi.org/10.7567/SSDM.2015.E-4-3