[CTuP5B] 3D and Volume Processing

[CTuP5B-01 (Invited)] Processing the bulk of silicon using IR ultrashort laser pulses – from waveguides to welding

*Stefan Nolte^1,2, Namig Alasgarzade¹, Alessandro Alberucci¹, Markus Blothe¹, Chandroth P. Jisha¹, Qingfeng Li¹, Gabor Matthäus¹, Maxime Chambonneau¹ (1. Friedrich Schiller Univ. Jena (Germany), 2. Fraunhofer IOF (Germany))

[Presentation Style] Online

We report on processing the bulk of silicon with infrared ultrashort laser pulses. The localized energy deposition and resulting material modifications enable various applications, from the inscription of waveguides to dicing and semiconductor–metal welding.