[P-CTh5] C5. Laser Processing and Innovative Applications

[P-CTh5-06] Deep Hole Drilling of Wide Bandgap Materials using Hybrid ArF Laser

*Takashi Onose¹, Hironori Igarashi¹, Yasuhiro Kamba¹, Taisuke Miura¹, Kouji Kakizaki¹ (1. Gigaphoton Inc. (Japan))

[Presentation Style] Onsite

We demonstrated a laser drilling on sintered SiC plate using hybrid ArF laser at the wavelength of 193 nm. We obtained a diagonal hole on 2-mm thick SiC plate at a slant angle of 20°