ICSCRM2019

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Oral Presentation

Growth and Wafer Manufacturing

[Fr-2B] Wafer Manufacturing

Fri. Oct 4, 2019 10:30 AM - 11:45 AM Annex Hall 2 (Kyoto International Conference Center)

11:00 AM - 11:15 AM

[Fr-2B-02] An approach to predict 4H-SiC wafer bending after back side thinning by substrate resistivity analysis

*Nicolo Piluso1 (1. STMicroelectronics(Italy))