ICSCRM2019

Presentation information

Oral Presentation

Growth and Wafer Manufacturing

[Fr-2B] Wafer Manufacturing

Fri. Oct 4, 2019 10:30 AM - 11:45 AM Annex Hall 2 (Kyoto International Conference Center)

11:30 AM - 11:45 AM

[Fr-2B-04] Direct bonding of diamond substrate at low temperatures under atmospheric condition

*Takashi Matsumae1, Yuichi Kurashima1, Hitoshi Umezawa1, Hideki Takagi1 (1. Ntl. Inst. of Adv. Ind. Sci. and Tech.(Japan))